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From Basic to Breakthrough

Lead Frames

Although stamping has traditionally been the technology for manufacturing lead frames, its high set-up costs, lack of flexibility, and  long lead times means that it’s not economical for scalable supply.

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Our market-leading lead frame chemical etching capability has the flexibility to meet the fast-paced nature of the electronics industry, and the precision required to manufacture ultra-fine pitch, high pin count lead frames, more cost-effectively than stamping.

Types

  • CAPACITOR Lead Frames

  • QFN Lead Frames

  • GTMS Lead Frames

Surface Finishes

  • Gold

  • Silver

  • Tin

  • Palladium

  • Selective Plating

Shape

  • Flat

  • Bent

  • Sharp / Rounded Edges

Materials

  • KOVAR 

  • CuBe2

  • Copper Alloys

Advantages

  • Low-cost tooling

  • High-density lead frames

  • Stress-free and burr-free

  • Short lead times

  • Scalable volumes

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