From Basic to Breakthrough
Microelectronic Hermetic Packaging
SURON provides a comprehensive range of components for hermetic packaging, serving both glass to metal sealing (GTMS) and ceramic to metal sealing applications.
Markets for these components include aerospace, defense and telecommunications. In addition to metal components, SURON also offers highly complex shaped preforms and thermal conductive parts.
Components for Microelectronic Hermetic Packing
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Lids
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Leadframes
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Metal Packages
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Carriers and Ceramic Substrate
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Preforms
Lids
SURON provides a comprehensive range of lids for hermetic packaging, for both glass to metal sealing (GTMS) and ceramic to metal sealing applications. Suron's custom lids are manufactured by integration of technologies, depending on the accuracy, complexity and plating requirements of each design.
Lead Frames
SURON produces custom GTMS (Glass-To-Metal-Sealing) lead frames in a variety of sizes and shapes, according to our customer's requirements, by in-house photochemical etching, followed by CNC bending, if required. Our in-house technologies allow SURON to provide rapid prototyping, scalable manufacturing, and burr-free lead frames.
Metal Packages
SURON's Kovar/Aluminum/Titanium packages are produced by a highly controlled milling process and are fully plated, in-house. Automatic inspection is performed, including x,z,y measurement by probe. These solutions can be delivered within a few weeks. Selective plating is available.
Solder Preform/Thermally Conductive Complex Shapes
Complex shapes of solder preform, or thermal conductive material can be found in aerospace and defense applications, specifically in radar systems. For complex shapes where micro features and high accuracy are required, a special, advanced cutting technology is critical. Our in-house, die-set-free capability gives SURON the power to deliver the complex and high precision shapes that R&D designers are looking for.
Carriers and Ceramic Substrate
With increasing power and speed demands in the microelectronics industry, one of the biggest challenges is dissipating heat in hermetically sealed devices that house sensitive electronic components. SURON's carriers are used as a heat management solution to ensure optimal performance of the microelectronic chip (Si / GaAs / InP / ...) found in microelectronic packages. MoCu, WCu, Alumina, and other ceramics are some of the materials with similar CTE properties to microelectronic chips. Their use enables reduction of internal stresses posed by temperature changes.
