Pico-laser Capabilities Report:
Copper Thinning/Removal from Copper Clad Sheets
Background: Copper clad sheets are a widespread raw material of the PCB industry. Commonly, copper clad sheets may be purchased at standard values of copper thickness (e.g. 1 ounce=35 microns, 0.5 ounce = 17 micron). Certain application require however copper thinning to non-standard values. The aim of this report is to demonstrate Suron’s new ability in thinning and in entirely stripping the copper from its dielectric substrate.
Methods: The basic raw material used for the experimental array was chosen to be a 0.1 mm thick copper clad, with FR4 as the dielectric substrate and 0.5 ounce (17 microns) copper. Circular patterns of approximately 5 mm diameter have been removed using a single diagonal lines approach at various laser parameters. Images were obtained under an x50 light microscope.
Results: The array of parameters used permitted for thinning of down to 2-4 microns resolution as can be appreciated from the figures below.
For figures and further information please click : Copper Removal – FR4
For start-up companies Suron develop processes and prototypes of different metal products. In these pictures you can see a work we made for a young start-up which required generating coupled copper-combs over FR4, where one of the combs is selectively plated using matte tin. The process includes photo chemical etching of FR4 and selective plating of the conductor’s copper.
The precision parts manufacturing market keeps on evolving. The latest trends include miniaturization of parts, increasing the level of precision, reducing the weight and to cut back elements which harms the product’s quality as a result of its processing.
The use in Electroforming and Photo Electroforming offer a great solution to the always evolving paths of this market/field.
Selective-wave soldering is alternative to wave-soldering, where individual through-hole (TH) pins see the wave serially, in a programmed order. Jigs for selective-wave soldering machines are commonly aimed at providing mechanical support to the TH components, thus preventing undesirable miss-alignment.
Steps in the Selective-wave Jig Design and Manufacturing Process:
- Customer uploads the PCB files (preferably both gerber and idf files).
- Customer is asked to ship samples of an assembled PCB.
- Detailed jig files are prepared by Suron’s experts.
- Optionally, the design is sent to the customer for approval prior to production.
- The files are handed over for production.
- A full inspection is carried out.
Similarly, Suron also designs and produces Wave-soldering pallets, Jigs for the SMT line, for de-paneling, for press-fit machinery, trays, re-balling devices, conformal coating.
Suron employs photochemical etching technology to process a broad range of metals and alloys for the production of precise, thin and flat metal parts for its customers. The photochemical etching process has many benefits, since the properties of the processed metal do not change, and the metal doesn’t suffer from stress.
The parts have a high level of precision and are burr free. Using photo etching technology, Suron can provide customers with a rapid manufacturing service for low cost parts on small and medium scales.
The photoetching process involves many stages. The first stage begins when the customer’s order and files are received. The planning department processes the data and produces slides that serve as the template for manufacturing the parts. The production department cuts the metal sheet to length, then cleans and coats it with a thin, plastic, light-sensitive material (a photoresist). The two slides are attached to the sheet, and the metal is exposed to UV radiation.
The rest of the process takes place in a chemical bath containing a corrosive solution. Through chemical development, the photopolymer that is not exposed to light (i.e. is masked by the black areas of the slide), is removed. The areas that are exposed to light (in contrast to the black parts) are corroded by the acid, resulting in a sheet whose components are joined by tabs and tags. At the end of the photochemical etching process, the remaining masking material is removed, and the sheet is dried and cleaned. The parts are disconnected from the sheet and sent for inspection. The Quality Assurance department performs visual inspections and checks measurements. In some cases, the parts are transferred to the plating department to apply a finish, or are sent for packaging.
Advantages of Photochemical Machining:
• Precision metal processing that does not change the metal’s composition or properties
• The process does not produce burrs
• Cost-effective for small and medium runs
• Can be used to create grooves, bend marks, grading, and precision engraving
• Low cost set-up and short lead time – enables quick solutions for R&D products, and to produce models and samples
Photochemical Machining Technical Details:
Part Size: 0.5mm to 600*850mm (unusual sizes of over a meter can be arranged)
Metal sheet Size: 23″X35″
Thickness of Material: (0.012-1.5) .0005″- .060″
Types of Materials: Stainless steel, Kovar, Invar, Nickel and Nickel Alloys, Steel, Copper, MoliCopper, Beryllium-Copper, Nickel-Silver, Phosphor Bronze, Brass, Aluminum, Titanium, Silver
Tolerance: 0.1T (not less than 0.012)