General Tooling Solution

General Tooling Solution

Suron designs and manufactures a wide range of high end tooling solutions.
Steps in the Standard Design and Manufacturing Process:
o Customer uploads the PCB files (preferably both Gerber and IDF files).
o Customer is asked to ship samples of an assembled PCB.
o Detailed jig files are prepared by Suron’s experts.
o Optionally, the design is sent to the customer for approval prior to production.
o The files are handed over for production.
o A full inspection is carried out.

Among others, Suron designs and produces Wave-soldering pallets, Jigs for the SMT line, for de-paneling, for press-fit machinery, for selective-wave machines, trays and re-balling devices.

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Selective Wave Jigs

Selective Wave Jigs

Selective-wave soldering is alternative to wave-soldering, where individual through-hole (TH) pins see the wave serially, in a programmed order. Jigs for selective-wave soldering machines are commonly aimed at providing mechanical support to the TH components, thus preventing undesirable miss-alignment.

Steps in the Selective-wave Jig Design and Manufacturing Process:

  • Customer uploads the PCB files (preferably both gerber and idf files).
  • Customer is asked to ship samples of an assembled PCB.
  • Detailed jig files are prepared by Suron’s experts.
  • Optionally, the design is sent to the customer for approval prior to production.
  • The files are handed over for production.
  • A full inspection is carried out.

Similarly, Suron also designs and produces Wave-soldering pallets, Jigs for the SMT line, for de-paneling, for press-fit machinery, trays, re-balling devices, conformal coating.

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SMT Jigs

SMT Jigs

Reflow soldering is the most common method of mounting components to a PCB. The soldering process includes dispensing (smearing) solder paste on the un-populated PCB prior to components placement. For optimal, wrinkle-less dispensing, thin / flexible / semi-rigid PCBs commonly require for dedicated jigs, aimed at supporting or slight pre-stretching the PCB.

Steps in the SMT-Jig Design and Manufacturing Process:

  • Customer uploads the PCB files (preferably both gerber and idf files).
  • Customer is asked to ship samples of an assembled PCB.
  • Detailed jig files are prepared by Suron’s experts.
  • Optionally, the design is sent to the customer for approval prior to production.
  • The files are handed over for production.
  • A full inspection is carried out.

Similarly, Suron also designs and produces Wave-soldering pallets, Jigs for de-paneling, for selective-wave machines, for press-fit machinery, trays, re-balling devices, conformal coating.

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Routing (De-Paneling) Jigs

Routing (De-Paneling) Jigs

PCB assembly may include routing-out the board from its panel (de-paneling). To insuring safe and reliable de-paneling, and to minimize the damaging effect of router’s vibrations on PCB integrity, dedicated jigs are commonly used, aimed at absorbing these vibrations and supplying mechanical support at strategic PCB locations.

Steps in the De-paneling Jig Design and Manufacturing Process:

  • Customer uploads the PCB files (preferably both gerber and idf files).
  • Customer is asked to ship samples of an assembled PCB.
  • Detailed jig files are prepared by Suron’s experts.
  • Optionally, the design is sent to the customer for approval prior to production.
  • The files are handed over for production.
  • A full inspection is carried out.

Similarly, Suron also designs and produces: Wave-soldering pallets, Jigs for the SMT line, for selective-wave machines, for press-fit machinery, trays, re-balling devices, conformal coating. jigs, trays, reballing devices, pallets for conformal coating, and devices for press-fit.

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Press-Fit Jigs

Press-Fit Jigs

Press-fit technology permits for solder-free components assembly, resulting in mechanical connection between the PCB and solder-free components (e.g. connectors, RF cages).

The press-fit process requires for a lower and an upper tool, where the former provides mechanical support to the PCB and the latter – to the pressed-in component.

    Steps in the Press-fit Jig Design and Manufacturing Process:

  • Customer uploads the files (PCB file for lower tools, component datasheets for upper tools).
  • Customer is asked to ship samples of an assembled PCB (for lower tools).
  • Detailed jig files are prepared by Suron’s experts.
  • Optionally, the design is sent to the customer for approval prior to production.
  • The files are handed over for production.
  • A full inspection is carried out.

Similarly, Suron also designs and produces Wave-soldering pallets, Jigs for the SMT line, for de-paneling, for selective-wave machines, trays, re-balling devices, conformal coating.

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SMT Stencils

SMT Stencils
Since the 1980s, Suron has been an industry leader in manufacturing SMT stencils. The company provides efficient, speedy solutions to overcome its customer’s engineering challenges in Israel and around the world.

Suron manufactures a broad range of soldering paste stencils for Surface Mount Technology (SMT) processes. The stencils are used by the electronics industry to place components when assembling printed circuit boards – PCB assembly. Solder stencils play an important part in circuit production, therefore the quality of the stencils is critical to successfully assemble and place circuit components. The stencil’s slots and dimensions must be precise so the solder paste can be spread uniformly, to avoid a short circuits or volids during the soldering process.

Stencils for SMT soldering paste are produced by laser cutting, etching, electroforming, and a mix of technologies. Suron produces a broad range of stencils: adhesive stencils for bonding components, manual stencils, local stencils, glass epoxy stencils, Piko-flow plated stencils, and nickel plated stencils. Graded stencils enable solder paste to be spread  simultaneously at variable heights (during the same application). The innovative Flexi Frame system offers flexible stretching frames for stencils. Suron manufactures customized stencils per customer specifications, as a joint effort between the customer’s planning and/or R&D department, and Suron.

SMT Stencil Production and Inspection Process:

• The customer’s files are received (the original files that were prepared by the PCB designer). The Planning Department opens the files and prepares the production files, fully detailing the stencil slots, frame, and the text engraved on it.
• File processing is completed.
• PDF files are sent to the customer.
• Customer approval is received, and the files are forwarded to the relevant production department.
• The stencil is manufactured.
• The stencil is handed over to Quality Assurance, where automatic inspection compares the stencil to the file. The examination includes full inspection of the slots, location, and dimensions.

Stencil Lead Time: within 24 hours.
Files that arrive by noon will be supplied the next day. Super-fast delivery solutions can be arranged in urgent cases.

Suron’s SMT Stencils are available in the following materials:
• Nickel-Cobalt (electroforming)
• Stainless Steel
• Brass
• Glass Epoxy

Plating for Stencils:
• Nickel-plated stencils
• PikoFlow plated stencils (a proprietary coating developed by Suron)

FlexiFrame – Innovative SMT Stencils The FlexiFrame was developed by Suron and is employed to maximize SMT stencil stretching. The use of the innovative frame significantly improves the application of solder paste, as well as placement of components. The stencil is stretched simultaneously at each of its edges to ensure uniform spreading of the solder paste. The FlexiFrame’s flexibility makes it possible to accommodate multiple stencils in one frame, thus enhancing the customer’s work process by eliminating the need for different types of stencils, and maintaining a stock of frames.

 

For professional consulting contact plotter@suron.co.il

 

 

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Details

Stencil thickness

ranges from 0.002” to 0.040″ (0.05 to 1 mm)

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Wave Solder Pallets

Wave Solder Pallets

Selective Wave Soldering Pallets are used to apply TH components to printed circuit boards during PCB assembly. The pallets are made of a glass epoxy insulated material. They protect the SMT components in the circuit and expose the unmasked components to wave soldering.

Wave Solder Pallets significantly streamline the circuit assembly process, eliminating the need for extensive manpower and manual labor.

Steps In the Manufacturing Process:

  • The customer’s files and a complex card are received (the original files that were prepared by the circuit editor).
  • The Planning Department opens the pallet files and inspects the card.
  • Detailed pallet files are prepared, including all the slots, dimensions, thickness, and areas that require masking of sensitive parts.
  • The files are sent to the customer for approval
  • Customer approval is received,  and the files are handed over for production
  • The raw material is milled
  • The palette is assembled by adding elements such as: clamps, buttons and bridges.
  • The pallet is manufactured and a full inspection is carried out.

Employing a similar process to wave solder pallets production, Suron also produces jigs, trays, reballing devices, pallets for conformal coating, and devices for press-fit.

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