Suron employs photochemical etching technology to process a broad range of metals and alloys for the production of precise, thin and flat metal parts for its customers. The photochemical etching process has many benefits, since the properties of the processed metal do not change, and the metal doesn’t suffer from stress.
The parts have a high level of precision and are burr free. Using photo etching technology, Suron can provide customers with a rapid manufacturing service for low cost parts on small and medium scales.
The photoetching process involves many stages. The first stage begins when the customer’s order and files are received. The planning department processes the data and produces slides that serve as the template for manufacturing the parts. The production department cuts the metal sheet to length, then cleans and coats it with a thin, plastic, light-sensitive material (a photoresist). The two slides are attached to the sheet, and the metal is exposed to UV radiation.
The rest of the process takes place in a chemical bath containing a corrosive solution. Through chemical development, the photopolymer that is not exposed to light (i.e. is masked by the black areas of the slide), is removed. The areas that are exposed to light (in contrast to the black parts) are corroded by the acid, resulting in a sheet whose components are joined by tabs and tags. At the end of the photochemical etching process, the remaining masking material is removed, and the sheet is dried and cleaned. The parts are disconnected from the sheet and sent for inspection. The Quality Assurance department performs visual inspections and checks measurements. In some cases, the parts are transferred to the plating department to apply a finish, or are sent for packaging.
Advantages of Photochemical Machining:
• Precision metal processing that does not change the metal’s composition or properties
• The process does not produce burrs
• Cost-effective for small and medium runs
• Can be used to create grooves, bend marks, grading, and precision engraving
• Low cost set-up and short lead time – enables quick solutions for R&D products, and to produce models and samples
Photochemical Machining Technical Details:
Part Size: 0.5mm to 600*850mm (unusual sizes of over a meter can be arranged)
Metal sheet Size: 23″X35″
Thickness of Material: (0.012-1.5) .0005″- .060″
Types of Materials: Stainless steel, Kovar, Invar, Nickel and Nickel Alloys, Steel, Copper, MoliCopper, Beryllium-Copper, Nickel-Silver, Phosphor Bronze, Brass, Aluminum, Titanium, Silver
Tolerance: 0.1T (not less than 0.012)
Suron owns a line of revolutionary micro-laser machinery for metal cutting. The use of laser cutting technology enables the company to maximize its work with clients, producing precision metal parts that are far superior to etching. Suron’s laser machines pump a laser beam through a water jet, significantly reducing the severity of the thermal influence on the HAZ (heat-affected zone) of the cut area.
Laser cutting technology allows the company to produce a variety of flat, miniature and precise parts, with complicated geometries. The method is suitable for processing all metals, coated metals, and certain non-metals such as: silicon, ceramics, and alumina.
Common Applications of Laser Cutting and Welding Technology:
• SMT stencils
• Manufacturing parts for the security industry
• Manufacturing components and assemblies for the medical industry using metals approved for medical implants
• Manufacturing parts for models and prototypes
• Manufacturing parts in 3D from tubular material
• Manufacturing parts from plated metals and non-metals such as: silicon, alumina and ceramics
Benefits of Employing Micro-Laser Technology:
• A straight cutting line
• A fast processing method with ultra-high precision (5 microns tolerance)
• Suitable for working with miniature parts
• Ability to cut 3D shapes
• Particularly suitable for rapid turnaround of small batches, especially for defense and medical startups that need to produce samples
• The preferred method for manufacturing high precision solder paste stencils for electronic circuits.
• Ideal processing method to meet the stringent requirements for producing medical implants, as well as applications for heart and artery diseases (since the welding process does not distort the metal’s properties, and prevents future problems in which the body might reject the implants)
Disadvantages of Using Micro-Laser Technology:
• Cannot be used to create blind holes and slots.
• Uneconomical for high-volume production.
Materials that Can Be Processed with Laser Cutting Technology:
All existing metals, coated metals, and non-metals such as: silicon, alumina, and ceramics.
Laser Cutting Technical Details:
Part size: from 0.5 mm to 850×600 mm (can also be fabricated in non-standard sizes of over a meter, if suitable)
Thickness of raw materials: stainless steel and hard metals – up to 0.4 mm; silicon, aluminum, and soft metals – up to 2 mm
Worksheet size: 24″x35″
Levels of precision / tolerances: +/- 5 microns
The metal processing is done by innovative computer aided precision milling systems, operating High Speed Cutting technology. Suron’s advanced machines have traffic control systems that ensure superior precision milling. The rapid system heads (spindles) are accurate, enabling a range of metals to be cut, including super metals and polymers.
Benefits of using high speed cutting technology:
• Capable of manufacturing high grade precision metal parts
• Leaves less heat in the metal, reducing the amount of damage
• Suitable for manufacturing flat, thick, large plates (thanks to large vacuum tables)
• Suitable for manufacturing components and parts produced from a mix of technologies
CNC milling technical details:
Thickness of Material: .005″-1″
Worksheet size: for aluminum milling: 27″X40″; for polymers and glass epoxy milling: 31″X40″
• thick material and large area: +/- 0.004 “
• standard: +/- 0.002 “
• special: +/-0.0004 “
Laser welding technology enables the production of small components, 3D components, and medical implants. Laser welding is the best way to assemble parts of a component, with or without welding material. Employing both CNC and manual laser welding, Suron is capable of producing particularly intricate components.
This welding technology has many advantages for producing medical devices, components for the aerospace and aviation industries, and other components composed of several metals.
Laser welding technology is capable of welding aluminum, stainless steel, and a variety of kovar and copper alloys.
Electroforming is a photochemical production method that uses selective electrolytic plating to produce the specified part. An additive process is employed to construct metal parts on a metal substrate (a mandrel), and the resulting shape is based on a preliminary photolithography process. Electroforming technology enables the most precise production. It is ideal for miniature parts and particularly intricate mesh grids.
Metal construction using the electroforming method involves the following stages: Processing the product file obtained from the customer, then preparing the slides and a sheet of conductive metal (the metal substrate). The metal that is used as a conduit is cleaned and selectively masked by light-sensitive material (photoresist). The substrate metal sheet is immersed in an electrolyte bath and suspended in it for the required duration, until the metal parts are formed on top of the metal substrate, in the areas that are not masked.
When the electroforming process is complete, and the parts conform to the specified dimensions (in terms of height and thickness), the conductive metal and the metal parts attached to it are removed from the electrolyte bath. At the end of the process the formed metal parts are detached from the metal substrate, by chemically corroding the metal substrate. The parts are cleaned and transferred to the Quality Assurance department for visual inspection, and to check the dimensions.
Electroforming technology enables the production of top grade precision metal parts. The precision metal forming process integrates built-in quality assurance, thanks to the ability to control the duration that the conductive metal is immersed in the bath. This ensures the production of superior parts with high repeatability.
Electroforming Technical Details:
Thickness of Material: .0002″-.008″
Metal sheet Size: 22″X24″
• thick material and large area: +/- 0.004 “
• standard: +/- 0.002 “
• special: +/- .0002 “
Suron produce electroformed stencils with the licensed NiColoy® process, developed by NiCoForm, Inc.
Suron’s plating and finishing department carries out a range of work on the metal parts produced in-house or out.
Types of Finishes:
• Stainless Steel Passivation
• Chemical Polishing
• Thermal Treatments
All finishes are applied per customer specifications, based on the intended use of the final product. Customers are offered a range of special finishing solutions.
Gold, Nickel and PikoFlow Plating:
Suron offers its customers gold and nickel plating services, and recently introduced tin plating and Piko Flow. The selection of plating options were designed for a range of uses: to improve the conductivity of metal, resist corrosion, make the metal solderable, and to expand the range of metal applications in the electronics industry.
Gold Plating – gold plating is applied to finished parts at the end of the production process. The metal parts can be plated in soft gold plating and hard gold plating mainly for the electronics industry.
Nickel Plating – there are several methods such as: electrolytical nickel plating, electroless nickel plating (without electricity), High Phosphor nickel plating and Low Phosphor nickel plating (relative to the level of phosphorus in the coating). Thermal treatment can be applied to harden the surface of the plated part to a value of 63HRC.
PikoFlow Plating – plating with PikoFlow is intended for laser SMT stencils and electroforming SMT stencils. Suron’s proprietary PikoFlow hydrophobic plating technology significantly enhances the stencils’ performance. The innovative plating gives the stencil surface hydrophobic properties, thus increasing the quality of releasing the solder paste from the plating of the pad. It reduces the value of the Area Ratio, and thus provides customers increased printing preformance especially for fine pitch micro-BGA and other intricate components.
All platings are done per customer specifications, based on the intended use of the final product.